PART |
Description |
Maker |
MC-4R64CPE6C-845 MC-4R64CPE6C MC-4R64CPE6C-653 MC- |
DRAGONBALL MXL DIE SALE Direct Rambus DRAM RIMM Module 64M-BYTE 32M-WORD x 16-BIT 直接Rambus的内存RIMM400模块技2M的字x 16
|
http:// NEC[NEC] NEC Corp. NEC, Corp.
|
907-0010 912-0120 914-0040 914-0070 914-0140 912-0 |
PUNCH&DIE SET 3-12MM PUNCH&DIE 10.0MM CIRCULAR PUNCH&DIE 16.5MM CIRCULAR PUNCH&DIE 25.0MM CIRCULAR PUNCH&DIE 12.0MM CIRCULAR PUNCH&DIE 9.0MM CIRCULAR PUNCH&DIE 20.0MM CIRCULAR PUNCH&DIE 12.5MM CIRCULAR STRIPPER 37.0 X 13.7 D CON STRIPPER 31.75MM DIAMETER 低产31.75MM直径 LOUVRE TOOL 卢浮宫工 PUNCH&DIE 10.0MM CIRCULAR STRIPPER 67.2 X 16.5 D CON
|
Peregrine Semiconductor, Corp. Molex, Inc.
|
TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
ANT7-M24LR16E |
15 mm x 15 mm double layer antenna reference board for the M24LR16E-R Dual Interface EEPROM, NOT FOR SALE
|
ST Microelectronics STMicroelectronics
|
SIDC01D60SIC2SAWN SIDC01D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 4A die sawn Diodes - HV Chips - 600V, 4A die unsawn
|
Infineon
|
AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD) 20NS, OTP, PLCC, COM TEMP(EPLD) 20NS, SOIC, IND TEMP(EPLD) 25NS, SOIC, COM TEMP(EPLD) 20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD) 10MHZ, 8 DIP, COM TEMP(FPGA) 10MHZ, 20 PLCC, IND TEMP(FPGA) 10MHZ, 32 TQFP, COM TEMP(FPGA) 10MHZ, 44 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA) 8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE) DIE SALE, 1.8V, 11 MIL(SERIAL EE) 8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE) 65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA) 10MHZ, 20 SOIC, IND TEMP(FPGA) 128K CONFIG MEM, 20 PLCC, COM(FPGA) EEPROM EEPROM 10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM 512K X 16 FLASH 3V PROM, 120 ns, UUC44 10MHZ, 8 LAP, 5K MOQ(FPGA) 10MHZ, 8 N-SOIC, COM TEMP(FPGA) 10MHZ, 20 PLCC, COM TEMP(FPGA) 512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
MS125 MS80 MS250 MS380 MS40 MS500 |
Surface Mount Si-Bridge-Rectifiers Si-Br?kengleichrichter f? die Oberfl?henmontage Surface Mount Si-Bridge-Rectifiers Si-Br?kengleichrichter f? die Oberfl溷henmontage
|
DIOTEC[Diotec Semiconductor]
|
HTCICC6402FUG HTCICC6403FUG |
HITAG RO64 Transponder IC HTCICC64; HITAG RO64 transponder IC HTCICC6402FUG/AM<Uncased die|<<<1<Always Pb-free,;HTCICC6403FUG/AM<Uncased die|<<<1<Always Pb-free,;
|
NXP Semiconductors N.V.
|
IXFN340N07 IXFN340N0704 |
HiPerFET?/a> Power MOSFETs Single Die MOSFET HiPerFET⑩ Power MOSFETs Single Die MOSFET HiPerFET Power MOSFETs Single Die MOSFET
|
IXYS Corporation
|
AM29F010-1 AM29F010-120DGC1 AM29F010-120DGE1 AM29F |
1 megabit CMOS 5.0 volt-only, uniform sector flash memory- die revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash MemoryDie Revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1 128K X 8 FLASH 5V PROM, 120 ns, UUC30 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1 128K X 8 FLASH 5V PROM, 90 ns, UUC30 Evaluation Board for LM3202 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers 128K X 8 FLASH 5V PROM, 90 ns, UUC30 LM3202 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers; Package: MICRO SMD; No of Pins: 8 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only Uniform Sector Flash Memory-Die Revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only/ Uniform Sector Flash Memory-Die Revision 1
|
ADVANCED MICRO DEVICES INC PROM Advanced Micro Devices, Inc. AMD[Advanced Micro Devices]
|
3606 3601 |
Die Cast Aluminum Box Painted, Size “D Die Cast Aluminum Box Painted, Size 隆掳D隆卤
|
Pomona Electronics
|
|